404: Not Found{"id":3477,"date":"2023-03-23T15:30:42","date_gmt":"2023-03-23T15:30:42","guid":{"rendered":"https:\/\/gigora.com\/u-s-prepares-to-establish-11-billion-nstc\/"},"modified":"2023-03-23T15:30:42","modified_gmt":"2023-03-23T15:30:42","slug":"u-s-prepares-to-establish-11-billion-nstc","status":"publish","type":"post","link":"https:\/\/gigora.com\/u-s-prepares-to-establish-11-billion-nstc\/","title":{"rendered":"U.S. Prepares to Establish $11 Billion NSTC"},"content":{"rendered":"

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The U.S. Department of Commerce (DOC), during the first quarter of this year, will issue guidelines<\/a> on the first proposals for the creation of the $11 billion National Semiconductor Technology Center (NSTC) aimed at restoring the nation\u2019s leadership in the chip industry.<\/p>\n

The effort is likened to the collaborative endeavor that created the world\u2019s first nuclear weapons. To take innovation from lab to fab, the NSTC, which is part of the U.S. CHIPS Act<\/a>, will be a public-private consortium joining government and industry, as well as academia, entrepreneurs, workforce representatives and investors.<\/p>\n

\u201cThis is a Manhattan Project moment,\u201d Carol Handwerker, a professor of semiconductor materials engineering at Purdue University, told EE Times in an exclusive interview.<\/p>\n

The implementation priorities include building domestic manufacturing capacity to reduce reliance on foreign production, Peter Bermel, an associate professor at Purdue, told EE Times in the same interview. He is developing chip radiation-hardening technology in a project funded by the U.S. Department of Defense.<\/p>\n

\u201cThe vast majority of chip manufacturing is happening abroad, and an even higher percentage of packaging, advanced packaging and heterogeneous integration,\u201d Bermel said.<\/p>\n

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