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Chiplets mark a new era of semiconductor innovation, and packaging is an intrinsic part of this ambitious design undertaking. However, while chiplet and packaging technologies work hand in hand to redefine the possibilities of chip integration, this technological tie-up isn\u2019t that simple and straightforward.<\/p>\n

In chip packaging, the bare chip die is encapsulated in a supporting case with electrical contacts. The case protects the bare die from physical harm and corrosion and connects the chip to a PCB. This form of chip packaging has existed for decades.<\/p>\n

However, due to the slowdown of Moore\u2019s law<\/a> and the increasing cost of monolithic IC manufacturing, the industry began to adopt advanced packaging techniques like silicon interposers. Advanced packaging also adds to the cost, which only large chips serving high-performance computing (HPC) applications can generally afford.<\/p>\n

Then, there\u2019s the added design complexity that comes with advanced packaging solutions. For instance, interposers require an extra piece of silicon, limiting the real estate that designers can put on chips. Moreover, silicon interposers limit overall system-in-package (SiP) size, which lowers wafer test coverage. That, in turn, impacts yield, increases total cost of ownership, and extends production cycle times.<\/p>\n

Enter chiplets, which promise smaller SiP footprints at lower power consumption. In other words, compared to advanced packaging technologies, chiplets can achieve similar bandwidth, power efficiency, and latency with die-to-die implementations\u2014all while using standard packaging.<\/p>\n